“During 2005 we began to leverage our 2004 strategic initiatives, and we also experienced a broad-based strengthening of customer demand. Our fourth quarter results reflect solid unit growth in strategic product areas, a richer product mix, a firmer pricing environment, and enhanced operating leverage in our newer factories.”
“During the fourth quarter we successfully increased production in our existing factories as well as our newer operations to support strong demand in several end markets, including wireless communications and consumer electronics. Our leadership in wafer bumping, wafer level processing, flip chip, 3D packaging and other advanced package and test solutions has created what we believe is a strong pipeline of business. We are focused on optimizing our business opportunities, leveraging our strategic alliance with IBM, and laying the groundwork for expansion in Singapore and China.”
“We have seen strong customer acceptance of our electroplated wafer bumping technology, including our lead-free bump, as well as wafer probe capability, and we expect to continue to strategically expand these resources.”
“It's up to the community to make this event a success. People don't have to do anything out of the ordinary to participate. They aren't required to give any extra. All you have to do to participate is go out to eat in one of our wonderful area restaurants.”
